Changzhou Mingseal Robot Technology Co., Ltd.
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AS200 Series High Speed Die Bonder
The AS200 series high- speed dispensing and bonding machine can be applied in the advanced MEMS bonding process to achieve die bonding of high-density and high-reliability, and supports versatile packages, such as QFN, SIP, LGA , BGA and FC , for a variety of different application
scenarios . Various advanced technologies and innovative processes are used in the design and production of the AS200 to ensure its high speed, high accuracy and versatility.
The AS200's modular whole-set design allows for rapid inline production and supports " Direct Attach-Flip Chip" function switching, making production more flexible and efficient.
In addition, the AS200 can be optionally designed to meet the DAF film heating process through its forward-looking track design , and achieve stable , high-speed and high-precision production through the optimized design of the dispensing and pick & place mechanisms and the reconfiguration of the motion logic.
The technical specifications and performance of AS200 meet international standards , making it a high performance , highly reliable and internationally competitive dispensing and die attaching machine, enabling customers to have minimal cost and maximum ROI.
Features and Advantages
Nearest handling path planning as per enabled modules.
Automatic calibration and bonding force monitoring with editable cycles.
Active vibration suppression system with <5um amplitude in the die bonding area at full speed.
Lightweight and rigid high-speed die bonding module with a max. speed of 15m/s.
Dust-proof jacket selectable.
Loading methods compatible for multiple forms of substrate/frame.
Substrate heating by changing tooling supportive.
Thin chip picking process by changing configuration supportive.
Capable of switchingand between Face-up bonding and Flip-chip bonding by adding and replacing configurations.
Visual inspection automatic adjustment of glue volume.
Optimal high speed and low vibration glue dispensing path planning.
Self-developed high precision dispensing controller of international standard.
Innovative lightweight decoupling dispensing mechanism with a max. accelerated velocity of 2.5g.
Core functions and technical parameters are on par with international competitors.
Core modules are self-developed to ensure subsequent expansion and upgrading.
Module-based agile architecture design to build advanced software matrix capability.
Capable of handling 12-inch wafers, comparable to competing 8-inch die bonder in terms of footprint.
Technical Specifications
| Model AS200 | ||
| Machine Size | Footprint (WxDxH) | 1180 X 1310 X 1700mm |
| Weight | around 1400kg | |
| Facilities | Voltage | 220 VAC(@ 50/60Hz) |
| Rated power | 1300VA | |
| Compressed air | Min. 0.5MPa | |
| Vacuum level | Min. -0.08MPa | |
| Nitrogen | 0.2 - 0.6MPa | |
| Wafer and Chip Size | Wafer size | 6" - 12" |
| Wafer table size | 8" - 12" | |
| Chip size | 0.25 - 15mm | |
| Process types | Epoxy DA/FC/DAF | |
| Substrate/Lead frame Size | Width | 20 - 110mm |
| Length | 110 - 310mm | |
| Thickness | 0.1 - 2.5mm | |
| Process | Bond force | 0.3 - 20N |
| Wafer table rotation | 0 - 360° | |
| Min. cycle time | 180ms | |
| Accuracy/Productivity | Standard accuracy mode | ±20um/0.5 ° ( 3σ) |
| High accuracy mode | ±12.5um/0.5 ° ( 3σ) | |
| Uptime | >98% | |
| Mean time without failure | >168 hours | |
