Changzhou Mingseal Robot Technology Co., Ltd.

Manufacturer from China
Verified Supplier
2 Years
Home / Products / Glue Micro Dispenser /

KSP series Single-Component Screw Valve Coating Sealing Bonding Filling Packaging Potting UV Curing Adhesive Thermal Gel

Contact Now
Changzhou Mingseal Robot Technology Co., Ltd.
Visit Website
City:changzhou
Province/State:jiangsu
Country/Region:china
Contact Person:MrZhang Jia-huan
Contact Now

KSP series Single-Component Screw Valve Coating Sealing Bonding Filling Packaging Potting UV Curing Adhesive Thermal Gel

Ask Latest Price
Video Channel
Brand Name :MingSeal
Model Number :KSP0150
Certification :CE Certificate,ISO,CE/ISO
Place of Origin :China
MOQ :1
Price :$1-$10000
Payment Terms :L/C, T/T, D/A, D/P, MoneyGram, Western Union
Delivery Time :5-60 days
Packaging Details :WOODEN
Condition :New
Type :KSP0150
Automatic grade :Automatic
After-sales service provided :Engineers available to service machinery overseas,Online support,Video technical support,No overseas service provided,Free spare parts
Warranty :One Year
Glue output per circle :10ul
stator/Rotor :D15/UD15
Statoe material :FFKM
more
Contact Now

Add to Cart

Find Similar Videos
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill 01:33
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
KSV1000 Concentric screw valve Camera AA Process MEMS Solder Paste Thermal Conductive Coating for Semiconductor 00:24
KSV1000 Concentric screw valve Camera AA Process MEMS Solder Paste Thermal Conductive Coating for Semiconductor
GS600M Online Visual Dispensing Machine MEMS Microphone MEMS Barometer  Ultra-Precision Dispensing  Controller 00:46
GS600M Online Visual Dispensing Machine MEMS Microphone MEMS Barometer Ultra-Precision Dispensing Controller
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill 00:29
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
FS600 Series Online Visual Dispensing Machine Underfill Dam&Fill Lens Gluing PUR Adhesive Dispensing for Middle Bezel 00:27
FS600 Series Online Visual Dispensing Machine Underfill Dam&Fill Lens Gluing PUR Adhesive Dispensing for Middle Bezel
GS600DD Fully- Automatic Dispensing Machine FCBGA Application Wire Bonding Encapsulation 00:24
GS600DD Fully- Automatic Dispensing Machine FCBGA Application Wire Bonding Encapsulation
KDP series TWO-COMPONENT SCREW VALVE two-component structural glue 00:22
KDP series TWO-COMPONENT SCREW VALVE two-component structural glue
VS300 Desktop Visual Dispensing MachineTWS Wireless Headset Receiver Linear Motor Speaker Flat Motor LCM 00:28
VS300 Desktop Visual Dispensing MachineTWS Wireless Headset Receiver Linear Motor Speaker Flat Motor LCM
View Product Description

KSP series Single-Component Screw Valve

KSP0150/KSP0450 series is a precision volumetric single-component screw valve, which is suitable for applications in which high-precision distribution of single-component fluid, and can be perfect distribution of low, medium and high viscosity fluids.

Eccentric Screw Valve Selection Table

Type Model Mixing ratio Flow rate Glue output per circle Minimum dispensing amount

Single-component

KSP0150

__

0.01~1.2mL/min

10uL

1uL

KSP0450

__

0.05~6mL/min

50uL

5uL

KSP0700

__

0.50~60mL/min

500uL

50uL

DSP0150

__

0.3~1.5mL/min

150uL

15uL

DSP1000

__

2~90mL/min

1000uL

100uL

Two-component

KDP0300

1:1/2:1

0.02~2.4mL/min

__

2uL

KDP03X0

4:1/10:1

0.11~1.32mL/min

__

11uL

KDP0900

1:1/2:1

0.1~12mL/min

__

10uL

KDP09X0

4:1/10:1

0.55~6.6mL/min

__

55uL

KDP0700

1:1/2:1

1~100mL/min

__

100uL

DDP0150

1:1/2:1

0.6~3mL/min

__

30uL

DDP1000

1:1/2:1

4~180mL/min

__

200uL

KSP series Single-Component Screw Valve Coating Sealing Bonding Filling Packaging Potting UV Curing Adhesive Thermal Gel

KSP series Single-Component Screw Valve Coating Sealing Bonding Filling Packaging Potting UV Curing Adhesive Thermal Gel

Inquiry Cart 0
You May Like
KDP series TWO-COMPONENT SCREW VALVE UV Curing Adhessive Thermal Coating Sealing Bonding Filiing Packaging Poting
KDP series TWO-COMPONENT SCREW VALVE UV Curing Adhessive Thermal Coating Sealing Bonding Filiing Packaging Poting
KDC/DC Series Precision Dispensing Controller VCM SEMICONDUCTOR CHIP DIE BOND MEMS SOLDER PASTE DISPENSING micro dosing
KDC/DC Series Precision Dispensing Controller VCM SEMICONDUCTOR CHIP DIE BOND MEMS SOLDER PASTE DISPENSING micro dosing
KSV1000 Concentric screw valve Camera AA Process MEMS Solder Paste Thermal Conductive Coating for Semiconductor
KSV1000 Concentric screw valve Camera AA Process MEMS Solder Paste Thermal Conductive Coating for Semiconductor
KPS2000 Series Piezoelectric Jetting Valve (Upgraded) Acoustics Semiconductor Optics Medical Stable and Consistent
KPS2000 Series Piezoelectric Jetting Valve (Upgraded) Acoustics Semiconductor Optics Medical Stable and Consistent
PJS-100 Series Piezoelectric Jetting Valve Acoustics Semiconductor Optics Automotive Electronics New Energy Battery
PJS-100 Series Piezoelectric Jetting Valve Acoustics Semiconductor Optics Automotive Electronics New Energy Battery
KSP Single-Component Screw Valve coating Sealing Bonding Filling Packaging Potting
KSP Single-Component Screw Valve coating Sealing Bonding Filling Packaging Potting
FS600 Series Online Visual Dispensing Machine Underfill Dam&Fill Lens Gluing PUR Adhesive Dispensing for Middle Bezel
FS600 Series Online Visual Dispensing Machine Underfill Dam&Fill Lens Gluing PUR Adhesive Dispensing for Middle Bezel
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600SU Underfill Dispensing Machine FCBGA, FCCSP, SIP Die Form Underfill Die Form Underfill
GS600M Online Visual Dispensing Machine MEMS Microphone MEMS Barometer  Ultra-Precision Dispensing  Controller
GS600M Online Visual Dispensing Machine MEMS Microphone MEMS Barometer Ultra-Precision Dispensing Controller
FS800 series automatic dispensing equipment new energy FPC industry met with the tilting & rotation module
FS800 series automatic dispensing equipment new energy FPC industry met with the tilting & rotation module
FS700 series automatic dispensing equipment power battery FPC and MiniLED SMT DAM&FIll MiniLED Dispensing
FS700 series automatic dispensing equipment power battery FPC and MiniLED SMT DAM&FIll MiniLED Dispensing
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600SW Wafer-Level Dispensing Machine RDL First WLP CUF Application For Wafer Form Underfill
GS600DD Fully- Automatic Dispensing Machine For Dam & Fill FCBGA Application Wire Bonding Encapsulation
GS600DD Fully- Automatic Dispensing Machine For Dam & Fill FCBGA Application Wire Bonding Encapsulation
Send your message to this supplier
*From:
*To:

Changzhou Mingseal Robot Technology Co., Ltd.

*Subject:
*Message:
Characters Remaining : (0/3000)
Contact Now